Details of the Publication
Paper Code   0884-2914
Title   Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects
Authors   Chen J Q, Guo J D,Ma H C, Liu K L,Zhu Q S,Shang J K
Corresponding Author   郭敬东
Title of Journal   JOURNAL OF MATERIALS RESEARCH
Year   2015
Volume   30
Number   8
Page   1065-1071
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