| Details of the Publication | |||
| Paper Code | 0884-2914 | ||
| Title | Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects | ||
| Authors | Chen J Q, Guo J D,Ma H C, Liu K L,Zhu Q S,Shang J K | ||
| Corresponding Author | 郭敬东 | ||
| Title of Journal | JOURNAL OF MATERIALS RESEARCH | ||
| Year | 2015 | ||
| Volume | 30 | ||
| Number | 8 | ||
| Page | 1065-1071 | ||
| Abstract | |||
| Full Text | |||
| Full Text Link | |||
| Others: | |||
| Classification: | |||
| Source: | |||
| close | |||