| Details of the Publication | |||
| Paper Code | |||
| Title | Communication—Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect | ||
| Authors | Zhu Q S, Zhang X， Li S J，Liu C Z，Li C F | ||
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| Title of Journal | JOURNAL OF THE ELECTROCHEMICAL SOCIETY | ||
| Year | 2019 | ||
| Volume | 166 | ||
| Number | 1 | ||
| Page | D3097 -D3099 | ||
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