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Paper Code  
Title   Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects
Authors   Liu, C. Z.; Wang, J. J.; Zhu, M. W.; Liu, X. M.; Lu, T. N.; Yang, J. R.
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Title of Journal   JOURNAL OF ELECTRONIC MATERIALS
Year   2021
Volume   50
Number  
Page   258-262
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