| Details of the Publication | |||
| Paper Code | |||
| Title | Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects | ||
| Authors | Liu, C. Z.; Wang, J. J.; Zhu, M. W.; Liu, X. M.; Lu, T. N.; Yang, J. R. | ||
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| Title of Journal | JOURNAL OF ELECTRONIC MATERIALS | ||
| Year | 2021 | ||
| Volume | 50 | ||
| Number | |||
| Page | 258-262 | ||
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