| Details of the Publication | |||
| Paper Code | |||
| Title | Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder | ||
| Authors | Yang, Jie; Zhang, Qingke; Song, Zhenlun | ||
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| Title of Journal | JOURNAL OF ELECTRONIC MATERIALS | ||
| Year | 2021 | ||
| Volume | 50 | ||
| Number | |||
| Page | 283-290 | ||
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