Details of the Publication
Paper Code  
Title   Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder
Authors   Yang, Jie; Zhang, Qingke; Song, Zhenlun
Corresponding Author  
Title of Journal   JOURNAL OF ELECTRONIC MATERIALS
Year   2021
Volume   50
Number  
Page   283-290
Abstract  
Full Text  
Full Text Link       
Others:
Classification:
Source:
close