| Details of the Publication | |||
| Paper Code | 2162-8726 | ||
| Title | Copper Bottom-up Filling for Through Silicon Via (TSV) Using Single JGB Additive | ||
| Authors | Tang J ,Zhu Q S,Zhang Y,Zhang X,Guo J D,Shang J K | ||
| Corresponding Author | 祝清省 | ||
| Title of Journal | ECS ELECTROCHEMISTRY LETTERS | ||
| Year | 2015 | ||
| Volume | 4 | ||
| Number | 9 | ||
| Page | D28-D30 | ||
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