| Details of the Publication | |||
| Paper Code | |||
| Title | Electromigration anisotropy introduced by tin orientation in solder joints | ||
| Authors | Chen, Jian-Qiang; Liu, Kai-Lang; Guo, Jing-Dong; Ma, Hui-Cai; Wei, Song; Shang, Jian-Ku | ||
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| Title of Journal | JOURNAL OF ALLOYS AND COMPOUNDS | ||
| Year | 2017 | ||
| Volume | 703 | ||
| Number | |||
| Page | 264-271 | ||
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