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| Paper Code | |||
| Title | Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints | ||
| Authors | Wang, Mingna; Wang, Jianqiu; Ke, Wei | ||
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| Title of Journal | MICROELECTRONICS RELIABILITY | ||
| Year | 2017 | ||
| Volume | 73 | ||
| Number | |||
| Page | 69-75 | ||
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