| Details of the Publication | |||
| Paper Code | |||
| Title | Revealing the maximum microhardness and thickness of hardened layers for copper with various grain sizes | ||
| Authors | C.X. Ren, Q. Wang*, J.P. Hou, Z.J. Zhang, H.J. Yang, Z.F. Zhang*. | ||
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| Title of Journal | Materials Science and Engineering: A | ||
| Year | 2020 | ||
| Volume | 778 | ||
| Number | |||
| Page | 139113-139113 | ||
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